Boya Di (Senior Member, IEEE) is an Assistant Professor with Peking University, China. She received the B.S. degree in electronic engineering from Peking University, China, in 2014, and the Ph.D. degree from the Department of Electronics, Peking University, in 2019. She was a PostDoctoral Researcher with Imperial College London from 2019 to 2021. Her current research interests include metasurfaces-enabled communications and sensing, aerial access networks. She was a recipient of the 2020 IEEE N2WOMEN Top-10 Rising Star in Communications and Networking, the 2022 IEEE ComSoc Asia-Pacific Outstanding Young Researcher Award, the 2023 IEEE ComSoc TCCN Publication Award, and 2024 IEEE GlobeCom Best Paper Award. She serves as the Vice Chair APB of IEEE TCCN TC. She also serves as an Associate Editor for IEEE Transactions on Vehicle Technology and an Editor for IEEE Communications Tutorials and Surveys and IEEE Internet of Things Journal.